Please use this identifier to cite or link to this item: http://bura.brunel.ac.uk/handle/2438/3181
Title: Steps towards the development of an experimentally verified simulation of pool nucleate boiling on a silicon wafer with artificial sites
Authors: Sanna, A
Karayiannis, TG
Kenning, DBR
Hutter, C
Sefiane, K
Walton, AJ
Golobic, I
Pavlovic, E
Nelson, RA
Keywords: Pool nucleate boiling;Silicon;Artificial sites
Issue Date: 2009
Publisher: Elsevier
Citation: Applied Thermal Engineering. 29 (7) 1327-1337
Abstract: Nucleate boiling is a very effective heat transfer cooling process, used in numerous industrial applications. Despite intensive research over decades, a reliable model of nucleate pool boiling is still not available. This paper presents a numerical and experimental investigation of nucleate boiling from artificial nucleation sites. The numerical investigation described in the first section of the paper is carried out by a hybrid mechanistic numerical code first developed at the University of Ljubljana to simulate the temperature field in a heated stainless steel plate with a large number of nucleation sites during pool boiling of water at atmospheric pressure. It is now being redeveloped to interpret experiments on pool boiling at artificial sites on a silicon plate and as a design tool to investigate different arrangements of sites to achieve high heat fluxes. The code combines full simulation of the temperature field in the solid wall with simplified models or correlations for processes in the liquid-vapour region. The current capabilities and limitations of the code are reviewed and improvements are discussed. Examples are given of the removal of computational constraints on the activation of sites in close proximity and improvements to the bubble growth model. Preliminary simulations are presented to compare the wall conditions to be used in the experiments on silicon at Edinburgh University with the conditions in current experiments on thin metal foils at Ljubljana. An experimental rig for boiling experiments with artificial cavities on a 0.38 mm thick silicon wafer immersed in FC-72, developed at Edinburgh University, is described in the second part of the paper.
URI: http://bura.brunel.ac.uk/handle/2438/3181
Appears in Collections:Mechanical and Aerospace Engineering
Dept of Mechanical and Aerospace Engineering Research Papers



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