Please use this identifier to cite or link to this item: http://bura.brunel.ac.uk/handle/2438/23723
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dc.contributor.authorAbu Ebayyeh, AARM-
dc.contributor.authorDanishvar, S-
dc.contributor.authorMousavi, A-
dc.date.accessioned2021-12-11T13:00:43Z-
dc.date.available2021-12-11T13:00:43Z-
dc.date.issued2021-12-10-
dc.identifier.citationAbu Ebayyeh, A.A.R.M., Danishvar, S. and Mousavi, A. (2021) 'An Improved Capsule Network (WaferCaps) for Wafer Bin Map Classification Based on DCGAN Data Upsampling,' IEEE Transactions on Semiconductor Manufacturing, 35 (1), pp. 50 - 59 (10). doi: 10.1109/TSM.2021.3134625.en_US
dc.identifier.issn0894-6507-
dc.identifier.urihttps://bura.brunel.ac.uk/handle/2438/23723-
dc.description.sponsorshipEuropean Union’s Horizon 2020 Research and Innovation Program, IQONIC Project, Grant agreement No. 820677.en_US
dc.format.extent50 - 59 (10)-
dc.format.mediumPrint-Electronic-
dc.language.isoen_USen_US
dc.publisherIEEEen_US
dc.rights© Copyright 2021 The Author(s). Published by IEEE. This work is licensed under a Creative Commons Attribution 4.0 License. For more information, see https://creativecommons.org/licenses/by/4.0/-
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/-
dc.subjectcapsule networken_US
dc.subjectdata augmentationen_US
dc.subjectdeep learningen_US
dc.subjectdefect detectionen_US
dc.subjectgenerative adversarial network (GAN)en_US
dc.subjectpattern recognitionen_US
dc.subjectsemiconductor manufacturingen_US
dc.subjectwafer bin map (WBM)en_US
dc.titleAn Improved Capsule Network (WaferCaps) for Wafer Bin Map Classification Based on DCGAN Data Upsamplingen_US
dc.typeArticleen_US
dc.identifier.doihttps://doi.org/10.1109/TSM.2021.3134625-
dc.relation.isPartOfIEEE Transactions on Semiconductor Manufacturing-
pubs.issue1-
pubs.publication-statusPublished-
pubs.volume35-
dc.identifier.eissn1558-2345-
dc.rights.holderThe Author(s)-
Appears in Collections:Dept of Electronic and Electrical Engineering Research Papers

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