Please use this identifier to cite or link to this item: http://bura.brunel.ac.uk/handle/2438/19599
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dc.contributor.authorBalart, M-
dc.contributor.authorGao, F-
dc.contributor.authorPatel, J-
dc.contributor.authorMiani, F-
dc.date.accessioned2019-11-15T13:05:27Z-
dc.date.available2019-08-07-
dc.date.available2019-11-15T13:05:27Z-
dc.date.issued2019-08-07-
dc.identifier.citationMetallography, Microstructure, and Analysis, 2019, 8 (4), pp. 566 - 572en_US
dc.identifier.issn2192-9270-
dc.identifier.urihttps://bura.brunel.ac.uk/handle/2438/19599-
dc.description.abstract© The Author(s) 2019. By utilizing data from the literature, we examine the effects of superheat and solute additions on the grain size (as measured by columnar grain length) in binary copper alloys. Our investigation provides support for an Arrhenius-like behavior of the superheat on the grain size. We also find a correlation between the columnar grain length at a constant degree of superheat and the variation of the reciprocal of the true growth restriction factor (1/Q) with P, Mg, Mn, Pb, and Sn solute additions to be a power of law of 1/3, which gave a better fit than a linear one.en_US
dc.description.sponsorshipEPSRC (UK)en_US
dc.format.extent566 - 572-
dc.language.isoenen_US
dc.publisherSpringer Natureen_US
dc.subjectgrain sizeen_US
dc.subjectgrowth restrictionen_US
dc.subjectsolidificationen_US
dc.subjectcopper alloysen_US
dc.titleEffects of Superheat and Solute Additions on the Grain Size in Binary Copper Alloys.en_US
dc.typeArticleen_US
dc.identifier.doihttps://doi.org/10.1007/s13632-019-00559-8-
dc.relation.isPartOfMetallography, Microstructure, and Analysis-
pubs.issue4-
pubs.publication-statusPublished-
pubs.volume8-
Appears in Collections:Dept of Mechanical and Aerospace Engineering Research Papers

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