Experimental and bond graph based sensitivity calculations for micro-scale robust engineering design

Abstract

Bond graph modeling and sensitivity analysis are used to provide a platform for the robust design of a small mechatronic device, a behind-the-ear (BTE) hearing aid. Two key components of the device, namely the telecoil and the receiver, are considered. Experimental measurements, bond graph simulation models and analytic sensitivity analysis are used to investigate the interaction between these components in order to gain insight into the effect of component placement on the robustness of the final product.