Please use this identifier to cite or link to this item: http://bura.brunel.ac.uk/handle/2438/25850
Full metadata record
DC FieldValueLanguage
dc.contributor.authorCai, Q-
dc.contributor.authorFang, C-
dc.contributor.authorMendis, C-
dc.contributor.authorChang, ITH-
dc.contributor.authorCantor, B-
dc.date.accessioned2023-01-23T11:45:38Z-
dc.date.available2023-01-23T11:45:38Z-
dc.date.issued2023-01-20-
dc.identifierORCID iDs: Changming Fang https://orcid.org/0000-0003-0915-7453; Chamini Mendis https://orcid.org/0000-0001-7124-0544; Isaac T.H. Chang https://orcid.org/0000-0003-4296-1240.-
dc.identifier168942-
dc.identifier.citationCai, Q. et al. (2023) 'Thermal behaviour and microstructure evolution of new ternary eutectic alloy in Al-Cu-Si-Ni system', Journal of Alloys and Compounds, 941, 168942 , pp. [1- 33]. doi: 10.1016/j.jallcom.2023.168942en_US
dc.identifier.issn0925-8388-
dc.identifier.urihttps://bura.brunel.ac.uk/handle/2438/25850-
dc.descriptionData availability: The authors do not have permission to share data.en_US
dc.descriptionAppendix A. Supplementary material: Word document (1MB) available online at https://www.sciencedirect.com/science/article/pii/S0925838823002451?via%3Dihub#sec0065 .-
dc.description.abstractCopyright © 2023 The Author(s). Eutectic alloys were fabricated from the quaternary Al-Cu-Si-Ni system via arc melting and suction casting. An invariant ternary eutectic reaction (α-Al+Si+θ-Al2(CuNi)) was found in the quaternary alloy system with a composition of Al67.2Cu24Si8Ni0.8 (wt.%). The dissolution of Ni (~1.7 at.%) into tetragonal θ-Al2Cu takes place during this ternary eutectic reaction. Density functional theory (DFT) calculations show that the configurational entropy stabilises this level of randomly substituted Ni with Cu sites in the θ-Al2Cu lattice at high temperatures. The as-solidified eutectic microstructure exhibits a lamellar θ-Al2(CuNi) phase showing fragmented lamellar morphology with a lamellar thickness of 130±30 nm and Si exhibits fibrous morphology with a fibre diameter below 100 nm. The thermal stability of the Al-Cu-Si-Ni eutectic alloy after post-solidification annealing was investigated, and the thermal stability of the ternary eutectic microstructure is better than the corresponding Al33Cu (wt.%) binary eutectic microstructure. It was found that Ni solution in θ-Al2(CuNi) phase contributes to the thermal stability of this ternary eutectic microstructure and β2-Al3(CuNi)2 (β1-(Cu2.9Ni0.1)Al type, Fm-3m) phase can transform from θ-Al2(CuNi) phase after annealing at different temperatures. The Al-Cu-Si-Ni eutectic alloy has excellent as-cast hardness together with thermal stability. It is potentially valuable for the design of new aluminium alloys for serving at elevated temperatures.en_US
dc.description.sponsorshipEngineering and Physical Sciences Research Council (EPSRC) for the financial support on Future Liquid Metal Engineering (LiME) Hub (EP/N007638/1).en_US
dc.format.extent1 - 14-
dc.format.mediumPrint-Electronic-
dc.languageEnglish-
dc.language.isoen_USen_US
dc.publisherElsevieren_US
dc.rightsCopyright © 2023 The Author(s). Published by Elsevier B.V. under a Creative Commons license (https://creativecommons.org/licenses/by/4.0/).-
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/-
dc.subjectaluminium alloysen_US
dc.subjectternary eutecticen_US
dc.subjectphase transformationen_US
dc.subjectthermal stabilityen_US
dc.titleThermal behaviour and microstructure evolution of new ternary eutectic alloy in Al-Cu-Si-Ni systemen_US
dc.typeArticleen_US
dc.identifier.doihttps://doi.org/10.1016/j.jallcom.2023.168942-
dc.relation.isPartOfJournal of Alloys and Compounds-
pubs.publication-statusPublished-
pubs.volume941-
dc.identifier.eissn1873-4669-
dc.rights.holderThe Author(s)-
Appears in Collections:Brunel Centre for Advanced Solidification Technology (BCAST)

Files in This Item:
File Description SizeFormat 
FullText.pdfCopyright © 2023 The Author(s). Published by Elsevier B.V. under a Creative Commons license (https://creativecommons.org/licenses/by/4.0/)23.2 MBAdobe PDFView/Open


This item is licensed under a Creative Commons License Creative Commons