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DC Field | Value | Language |
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dc.contributor.author | Cai, Q | - |
dc.contributor.author | Fang, C | - |
dc.contributor.author | Mendis, C | - |
dc.contributor.author | Chang, ITH | - |
dc.contributor.author | Cantor, B | - |
dc.date.accessioned | 2023-01-23T11:45:38Z | - |
dc.date.available | 2023-01-23T11:45:38Z | - |
dc.date.issued | 2023-01-20 | - |
dc.identifier | ORCID iDs: Changming Fang https://orcid.org/0000-0003-0915-7453; Chamini Mendis https://orcid.org/0000-0001-7124-0544; Isaac T.H. Chang https://orcid.org/0000-0003-4296-1240. | - |
dc.identifier | 168942 | - |
dc.identifier.citation | Cai, Q. et al. (2023) 'Thermal behaviour and microstructure evolution of new ternary eutectic alloy in Al-Cu-Si-Ni system', Journal of Alloys and Compounds, 941, 168942 , pp. [1- 33]. doi: 10.1016/j.jallcom.2023.168942 | en_US |
dc.identifier.issn | 0925-8388 | - |
dc.identifier.uri | https://bura.brunel.ac.uk/handle/2438/25850 | - |
dc.description | Data availability: The authors do not have permission to share data. | en_US |
dc.description | Appendix A. Supplementary material: Word document (1MB) available online at https://www.sciencedirect.com/science/article/pii/S0925838823002451?via%3Dihub#sec0065 . | - |
dc.description.abstract | Copyright © 2023 The Author(s). Eutectic alloys were fabricated from the quaternary Al-Cu-Si-Ni system via arc melting and suction casting. An invariant ternary eutectic reaction (α-Al+Si+θ-Al2(CuNi)) was found in the quaternary alloy system with a composition of Al67.2Cu24Si8Ni0.8 (wt.%). The dissolution of Ni (~1.7 at.%) into tetragonal θ-Al2Cu takes place during this ternary eutectic reaction. Density functional theory (DFT) calculations show that the configurational entropy stabilises this level of randomly substituted Ni with Cu sites in the θ-Al2Cu lattice at high temperatures. The as-solidified eutectic microstructure exhibits a lamellar θ-Al2(CuNi) phase showing fragmented lamellar morphology with a lamellar thickness of 130±30 nm and Si exhibits fibrous morphology with a fibre diameter below 100 nm. The thermal stability of the Al-Cu-Si-Ni eutectic alloy after post-solidification annealing was investigated, and the thermal stability of the ternary eutectic microstructure is better than the corresponding Al33Cu (wt.%) binary eutectic microstructure. It was found that Ni solution in θ-Al2(CuNi) phase contributes to the thermal stability of this ternary eutectic microstructure and β2-Al3(CuNi)2 (β1-(Cu2.9Ni0.1)Al type, Fm-3m) phase can transform from θ-Al2(CuNi) phase after annealing at different temperatures. The Al-Cu-Si-Ni eutectic alloy has excellent as-cast hardness together with thermal stability. It is potentially valuable for the design of new aluminium alloys for serving at elevated temperatures. | en_US |
dc.description.sponsorship | Engineering and Physical Sciences Research Council (EPSRC) for the financial support on Future Liquid Metal Engineering (LiME) Hub (EP/N007638/1). | en_US |
dc.format.extent | 1 - 14 | - |
dc.format.medium | Print-Electronic | - |
dc.language | English | - |
dc.language.iso | en_US | en_US |
dc.publisher | Elsevier | en_US |
dc.rights | Copyright © 2023 The Author(s). Published by Elsevier B.V. under a Creative Commons license (https://creativecommons.org/licenses/by/4.0/). | - |
dc.rights.uri | https://creativecommons.org/licenses/by/4.0/ | - |
dc.subject | aluminium alloys | en_US |
dc.subject | ternary eutectic | en_US |
dc.subject | phase transformation | en_US |
dc.subject | thermal stability | en_US |
dc.title | Thermal behaviour and microstructure evolution of new ternary eutectic alloy in Al-Cu-Si-Ni system | en_US |
dc.type | Article | en_US |
dc.identifier.doi | https://doi.org/10.1016/j.jallcom.2023.168942 | - |
dc.relation.isPartOf | Journal of Alloys and Compounds | - |
pubs.publication-status | Published | - |
pubs.volume | 941 | - |
dc.identifier.eissn | 1873-4669 | - |
dc.rights.holder | The Author(s) | - |
Appears in Collections: | Brunel Centre for Advanced Solidification Technology (BCAST) |
Files in This Item:
File | Description | Size | Format | |
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FullText.pdf | Copyright © 2023 The Author(s). Published by Elsevier B.V. under a Creative Commons license (https://creativecommons.org/licenses/by/4.0/) | 23.2 MB | Adobe PDF | View/Open |
This item is licensed under a Creative Commons License