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Please use this identifier to cite or link to this item: http://bura.brunel.ac.uk/handle/2438/24381
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dc.contributor.authorQi, M-
dc.contributor.authorYin, T-
dc.contributor.authorCheng, G-
dc.contributor.authorXu, Y-
dc.contributor.authorMeng, H-
dc.contributor.authorWang, Y-
dc.contributor.authorCui, S-
dc.date.accessioned2022-04-01T10:04:47Z-
dc.date.available2022-04-01T10:04:47Z-
dc.date.issued2022-03-25-
dc.identifier.citationQi, M. et al. (2022) 'Research on Printing Defects Inspection of Solder Paste Images", Wireless Communications and Mobile Computing', 2022, Article ID 8651956, pp. 1 - 9. doi: 10.1155/2022/8651956.en_US
dc.identifier.issn1530-8669-
dc.identifier.urihttps://bura.brunel.ac.uk/handle/2438/24381-
dc.descriptionData Availability: The datasets used and/or analyzed during the current study are available from the corresponding author on reasonable request.-
dc.description.abstractCopyright © 2022 Min Qi et al. Solder paste printing is the first part of the surface mount process flow; its postprinting defect inspection is particularly important. In this paper, we focus on studying the printing defects inspection algorithm for solder paste on PCB (Printed Circuit Board) images. +e work proposes a number of methods to enhance the defects inspection performance of solder paste printing: a regional multidirectional data fusion image interpolation method, which can achieve fast and high precision image interpolation; a method for detecting solder paste areas with better accuracy, efficiency, and robustness; an improved connected domain labeling method to reduce time complexity; and defects detection and types classification method, which extracts features and centroid of every solder paste region and completes the inspection by comparing with a standard image. +e experiments show that the defects inspection algorithm can detect the most common types of defects with low time consumption, high inspection accuracy, and classification accuracy.en_US
dc.description.sponsorshipKey Project of Shaanxi Province Innovation Program, China (2017ZDCXL-GY-11-02-02)en_US
dc.format.extent1 - 9-
dc.languageEnglish-
dc.language.isoenen_US
dc.publisherHindawi Limiteden_US
dc.rightsCopyright © 2022 Min Qi et al. This is an open access article distributed under the Creative Commons Attribution License (https://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.-
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/-
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/-
dc.subjectsolder paste inspectionen_US
dc.subjectimage interpolationen_US
dc.subjectsolder paste area detectionen_US
dc.subjectconnected domain labelingen_US
dc.titleResearch on Printing Defects Inspection of Solder Paste Imagesen_US
dc.typeArticleen_US
dc.identifier.doihttps://doi.org/10.1155/2022/8651956-
dc.relation.isPartOfWireless Communications and Mobile Computing-
pubs.publication-statusPublished-
pubs.volume2022-
dc.identifier.eissn1530-8677-
dc.rights.holderMin Qi et al.-
Appears in Collections:Dept of Electronic and Electrical Engineering Research Papers

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