Please use this identifier to cite or link to this item:
http://bura.brunel.ac.uk/handle/2438/18349
Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Cuvero, MA | - |
dc.contributor.author | Evans, RD | - |
dc.contributor.author | Granados, M | - |
dc.contributor.author | Pilkington, A | - |
dc.coverage.spatial | Evanston, IL, USA | - |
dc.date.accessioned | 2019-06-07T12:33:26Z | - |
dc.date.available | 2019-06-07T12:33:26Z | - |
dc.date.issued | 2018-10-09 | - |
dc.identifier.citation | Cuvero, MA. et al. (2018) 'A Knowledge Spillover-based Approach to New Product Conceptualization', 2018 IEEE Technology and Engineering Management Conference, TEMSCON, Evanston, IL, USA, 28 June -01 July, pp. 1 - 6. doi: 10.1109/TEMSCON.2018.8488426. | en_US |
dc.identifier.isbn | 978-1-5386-2047-2 (ebk) | - |
dc.identifier.isbn | 978-1-5386-2048-9 (PoD) | - |
dc.identifier.uri | https://bura.brunel.ac.uk/handle/2438/18349 | - |
dc.format.extent | 1 - 6 | - |
dc.format.medium | Print-Electronic | - |
dc.language.iso | en | en_US |
dc.publisher | Institute of Electrical and Electronics Engineers (IEEE) | en_US |
dc.rights | Copyright © 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. | - |
dc.rights.uri | https://www.ieee.org/publications/rights/rights-policies.html | - |
dc.subject | knowledge spillovers | - |
dc.subject | absorptive capacity | - |
dc.subject | incubators | - |
dc.subject | new product development | - |
dc.subject | product conceptualization | - |
dc.title | A Knowledge Spillover-based Approach to New Product Conceptualization | en_US |
dc.type | Conference Paper | en_US |
dc.identifier.doi | https://doi.org/10.1109/TEMSCON.2018.8488426 | - |
dc.relation.isPartOf | 2018 IEEE Technology and Engineering Management Conference, TEMSCON 2018 | - |
pubs.finish-date | 2018-07-01 | - |
pubs.publication-status | Published | - |
pubs.start-date | 2018-06-28 | - |
dc.rights.holder | Institute of Electrical and Electronics Engineers (IEEE) | - |
Appears in Collections: | Brunel Design School Research Papers Brunel Business School Research Papers |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
FullText.pdf | Copyright © 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. | 370.71 kB | Adobe PDF | View/Open |
Items in BURA are protected by copyright, with all rights reserved, unless otherwise indicated.