Lithographic technology for microwave integrated circuits

Please use this identifier to cite or link to this item: http://bura.brunel.ac.uk/handle/2438/1803

Full metadata record

DC Field	Value	Language
dc.contributor.author	Shepherd, PR	-
dc.contributor.author	Evans, PSA	-
dc.contributor.author	Ramsey, BJ	-
dc.contributor.author	Harrison, DJ	-
dc.coverage.spatial	2	en
dc.date.accessioned	2008-03-07T16:00:36Z	-
dc.date.available	2008-03-07T16:00:36Z	-
dc.date.issued	1997	-
dc.identifier.citation	IEE Electronics Letters. 33 (6) 483 - 484	en
dc.identifier.issn	0013-5194	-
dc.identifier.uri	http://bura.brunel.ac.uk/handle/2438/1803	-
dc.description.abstract	Conductive lithographic films (CLFs) have been developed primarily as substitutes for resin/laminate boards, which share properties with the metallisation patterns used in planar microwave integrated circuits (MICs). The authors examine the microwave properties of the films and show that, although the losses are greater, they have potential as an alternative to the traditional manufacturing process of MICs.	en
dc.format.extent	310901 bytes	-
dc.format.mimetype	application/pdf	-
dc.language.iso	en	-
dc.publisher	IEEE	en
dc.subject	Microwave integrated circuits	en
dc.subject	Lithography	en
dc.title	Lithographic technology for microwave integrated circuits	en
dc.type	Research Paper	en
Appears in Collections:	Design Brunel Design School Research Papers

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