Brunel University Research Archive(BURA) preserves and enables easy and open access to all
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Research contained within BURA is open access, although some publications may be subject
to publisher imposed embargoes. All awarded PhD theses are also archived on BURA.
Please use this identifier to cite or link to this item:
http://bura.brunel.ac.uk/handle/2438/17771Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Adibhatla, VA | - |
| dc.contributor.author | Shieh, JS | - |
| dc.contributor.author | Abbod, MF | - |
| dc.contributor.author | Chih, HC | - |
| dc.contributor.author | Hsu, CC | - |
| dc.contributor.author | Cheng, J | - |
| dc.coverage.spatial | Taipei, Taiwan, Taiwan | - |
| dc.date.accessioned | 2019-03-25T11:30:10Z | - |
| dc.date.available | 2019-01-24 | - |
| dc.date.available | 2019-03-25T11:30:10Z | - |
| dc.date.issued | 2019 | - |
| dc.identifier.citation | Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2019, 2018-October pp. 202 - 205 | en_US |
| dc.identifier.issn | 2150-5934 | - |
| dc.identifier.issn | http://dx.doi.org/10.1109/IMPACT.2018.8625828 | - |
| dc.identifier.uri | http://bura.brunel.ac.uk/handle/2438/17771 | - |
| dc.format.extent | 202 - 205 | - |
| dc.language.iso | en | en_US |
| dc.publisher | IEEE | en_US |
| dc.source | 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) | - |
| dc.source | 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) | - |
| dc.subject | Convolution | en_US |
| dc.subject | Deep learning | en_US |
| dc.subject | Training | en_US |
| dc.subject | Inspection | en_US |
| dc.title | Detecting defects in PCB using deep learning via convolution neural networks | en_US |
| dc.type | Conference Paper | en_US |
| dc.identifier.doi | http://dx.doi.org/10.1109/IMPACT.2018.8625828 | - |
| dc.relation.isPartOf | Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT | - |
| pubs.finish-date | 2018-10-26 | - |
| pubs.finish-date | 2018-10-26 | - |
| pubs.publication-status | Published | - |
| pubs.start-date | 2018-10-24 | - |
| pubs.start-date | 2018-10-24 | - |
| pubs.volume | 2018-October | - |
| Appears in Collections: | Dept of Electronic and Electrical Engineering Embargoed Research Papers | |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| FullText.pdf | Embargoed until 1/1/2030 | 650.32 kB | Adobe PDF | View/Open |
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