Strengthening mechanisms in nanostructured Al/SiCp composite manufactured by accumulative press bonding

Abstract

The strengthening mechanisms in nanostructured Al/SiCp composite deformed to high strain by a novel severe plastic deformation process, accumulative press bonding (APB), were investigated. The composite exhibited yield strength of 148 MPa which was 5 and 1.5 times higher than that of raw aluminum (29 MPa) and aluminum-APB (95 MPa) alloys, respectively. A remarkable increase was also observed in the ultimate tensile strength of Al/SiCp-APB composite, 222 MPa, which was 2.5 and 1.2 times greater than the obtained values for raw aluminum (88 MPa) and aluminum-APB (180 MPa) alloys, respectively. Analytical models well described the contribution of various strengthening mechanisms. The contributions of grain boundary, strain hardening, thermal mismatch, Orowan, elastic mismatch, and load-bearing strengthening mechanisms to the overall strength of the Al/SiCp microcomposite were 64.9, 49, 6.8, 2.4, 5.4, and 1.5 MPa, respectively. Whereas Orowan strengthening mechanism was considered as the most dominating strengthening mechanism in Al/SiCp nanocomposites, it was negligible for strengthening the microcomposite. Al/SiCp nanocomposite showed good agreement with quadratic summation model; however, experimental results exhibited good accordance with arithmetic and compounding summation models in the microcomposite. While average grain size of the composite reached 380 nm, it was less than 100 nm in the vicinity of SiC particles as a result of particle-stimulated nucleation mechanism.