Please use this identifier to cite or link to this item: http://bura.brunel.ac.uk/handle/2438/10723
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dc.contributor.authorHolloway, AF-
dc.contributor.authorNabok, A-
dc.contributor.authorThompson, M-
dc.contributor.authorRay, AK-
dc.contributor.authorCrowther, D-
dc.contributor.authorSiddiqi, J-
dc.date.accessioned2015-05-01T13:15:36Z-
dc.date.available2003-06-
dc.date.available2015-05-01T13:15:36Z-
dc.date.issued2003-
dc.identifier.citationSENSORS, 2003, 3 (6), pp. 187 - 191en_US
dc.identifier.issn1424-8220-
dc.identifier.urihttp://bura.brunel.ac.uk/handle/2438/10723-
dc.description.abstractThe Impedance analysis technique complemented with curve fitting software was used to monitor changes in film properties of Thickness Shear Mode (TSM) resonator on vapour exposure. The approach demonstrates how sensor selectivity can be achieved through unique changes in film viscosity caused by organic vapour adsorption.en_US
dc.format.extent187 - 191-
dc.languageEN-
dc.language.isoenen_US
dc.publisherMOLECULAR DIVERSITY PRESERVATION INTERNATIONALen_US
dc.subjectImpedance analysisen_US
dc.subjectQCMen_US
dc.subjectTSM resonatoren_US
dc.subjectBVD modelen_US
dc.subjectFilmsen_US
dc.titleNew method of vapour discrimination using the Thickness Shear Mode (TSM) resonatoren_US
dc.typeArticleen_US
dc.relation.isPartOfSENSORS-
pubs.issue6-
pubs.issue6-
pubs.volume3-
pubs.volume3-
Appears in Collections:Wolfson Centre for Sustainable Materials Development and Processing

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